{"id":9175,"productCode":"SPCU1D3T0006N","chemicalCode":"Cu","name":"Copper metal","customName":null,"otherNames":"","formula":"Cu","purity":99.999,"form":"SP","size":"1 inch dia x 0.125 inch th.","composition":"","description":"","productionMethod":"VIM","bulkAvailable":null,"productionStatus":"Stock","hazmat":null,"status":null,"repackage":false,"priceBase":"120.00","quantityBase":"pcs","bulkAvailability":true,"inProduction":"","factoryCode":"","publicComments":"","privateComments":"","chemicalCodeLetters":null,"image":null,"sizeData":"{\"formSize\":\"45\",\"size_form\":[{\"input_value\":\"1\"},{\"select\":{\"value\":\"inch\",\"options\":[{\"value\":\"mm\",\"text\":\"mm\"},{\"value\":\"inch\",\"text\":\"inch\"}]}},{\"text\":\"dia x\"},{\"input_value\":\"0.125\"},{\"select\":{\"value\":\"inch\",\"options\":[{\"value\":\"mm\",\"text\":\"mm\"},{\"value\":\"inch\",\"text\":\"inch\"}]}},{\"text\":\"th.\"}]}","isLocked":true,"isSearchable":true,"storedLocation":null,"chemicalId":313,"old_chem_id":null,"createdAt":"2017-11-14T15:54:00.000Z","updatedAt":"2018-02-26T17:55:11.000Z","deleted":false,"deletedAt":null,"userChangedById":null,"hts":null,"Chemical":{"id":313,"formula":"Cu","productLetters":"CU","name":"Copper","otherNames":"Grade Cu101/Cu102, Copper metal","cas":"7440-50-8","einecs":"231-159-6","hazmat":"Powder: Class 4.1, UN3089, PG III","data":"","applications":[{"title":"Sputtering","description":"High-purity copper sputtering targets are used to deposit conductive thin films and interconnects in integrated circuits and electronic components."},{"title":"Alloying","description":"Copper is a primary alloying element used to enhance the mechanical properties, corrosion resistance, and conductivity of various non-ferrous metal systems."},{"title":"3D printing metal powder","description":"Spherical copper powders are utilized in additive manufacturing processes like Selective Laser Melting (SLM) to produce complex thermal management components."},{"title":"Evaporation materials","description":"Copper pellets and wire are used as source materials in physical vapor deposition to create high-conductivity metallic layers on substrates."},{"title":"Semiconductors","description":"Copper is used in semiconductor fabrication for metallization layers and through-silicon vias (TSVs) due to its superior electromigration resistance and low resistivity."},{"title":"Nanomaterials","description":"Copper nanoparticles are researched and applied in conductive inks, catalysts, and antimicrobial coatings due to their high surface-area-to-volume ratio."}],"publicComments":"<p style=\"font-family:Calibri;font-size:10.0pt;margin:0in;\">Copper is a key material in semiconductor manufacturing, where it is used for interconnects and wiring layers because of its high electrical conductivity and reliability in integrated circuits<sup> [1]</sup>. In TFT displays and electronic backplanes, copper thin films are used as conductive layers to enable fast signal transmission and improved device performance<sup> [2]</sup>. Copper is also widely used in battery materials, serving as a current collector in lithium-ion batteries due to its stability and low electrical resistance<sup> [3]</sup>. High-purity copper is supplied in forms suitable for evaporation and physical vapor deposition, supporting thin-film fabrication for electronics, coatings, and advanced manufacturing applications, including 3D printing feedstocks and backing plate materials.</p>","privateComments":"Catalyst and chemical reagent.\r\n\r\nCopper acts as a conductor of heat and electricity, catalyst, and as conductive additives. It has applications\r\nin architecture, automotive, electrical, electrical energy efficiency, power quality, building wire, and tube,\r\npipe fitting. Further, copper nanoparticles serve as a catalyst, as a conductive coatings, conductive slurry,\r\nand inks. The copper nano powder is used to manufacture internal electrode and electronic slurry for the miniaturization of microelectronics devices.","specialNotes":"","specialNotesProduct":false,"sds":"public/sds/Cu.pdf_a595bb/Cu.pdf","smiles":"[Cu]","inchi":"InChI=1S/Cu","inchiKey":"RYGMFSIKBFXOCR-UHFFFAOYSA-N","molecularWeight":"63.55 g/mol","iupac":"copper","eccn":"","hts":"","atomicNumber":29,"atomicWeight":"63.546 u","meltingPoint":"1084.62 °C","boilingPoint":"2562 °C","density":"8.96 g/cm³","crystalStructure":"Face-centered cubic","colorAppearance":"Reddish-orange metallic luster","thermalConductivity":"401 W/(m·K)","electricalResistivity":"1.68 μΩ·cm","coefficientOfExpansion":"16.5 µm/(m·K)","electronegativity":"1.90","neutronCrossSection":"3.78 barns","electronConfiguration":"[Ar] 3d10 4s1","createdAt":"2023-08-14T16:15:34.000Z","updatedAt":"2026-07-08T15:07:56.827Z","deleted":false,"deletedAt":null,"userChangedById":7,"customContent":"","displayFormula":"","bottomText":"<p><span class=\"text-tiny\">References</span></p><ol style=\"direction:ltr;font-family:Calibri;font-size:10.0pt;font-style:normal;font-weight:normal;margin-bottom:0in;margin-top:0in;unicode-bidi:embed;\" type=\"1\"><li style=\"margin-bottom:0;margin-top:0;vertical-align:middle;\" value=\"1\"><span style=\"font-family:Calibri;font-size:10.0pt;font-style:normal;\"><strong>Edelstein, D.; et al.</strong></span><br><span style=\"font-family:Calibri;font-size:10.0pt;font-style:normal;\"><strong>“</strong></span><span style=\"font-family:Calibri;font-size:10.0pt;font-style:normal;font-weight:normal;\">Full copper wiring in a sub-0.25 µm CMOS ULSI technology,”</span><br><i><span style=\"font-family:Calibri;font-size:10.0pt;font-weight:normal;\">IEEE International Electron Devices Meeting (IEDM) Technical Digest</span></i><span style=\"font-family:Calibri;font-size:10.0pt;font-style:normal;font-weight:normal;\">, 1997, 773–776.&nbsp;</span><a href=\"https://doi.org/10.1109/IEDM.1997.650496\"><span style=\"font-family:Calibri;font-size:10.0pt;\">DOI</span></a></li><li style=\"margin-bottom:8pt;margin-top:0pt;vertical-align:middle;\" value=\"2\"><span style=\"font-family:Calibri;font-size:10.0pt;font-style:normal;\"><strong>Nathan, A.; et al.</strong></span><br><span style=\"font-family:Calibri;font-size:10.0pt;font-style:normal;\"><strong>“</strong></span><span style=\"font-family:Calibri;font-size:10.0pt;font-style:normal;font-weight:normal;\">Flexible electronics: The next ubiquitous platform,”</span><br><i><span style=\"font-family:Calibri;font-size:10.0pt;font-weight:normal;\">Proceedings of the IEEE</span></i><span style=\"font-family:Calibri;font-size:10.0pt;font-style:normal;font-weight:normal;\">, 100 (2012) 1486–1517.</span><a href=\"https://ieeexplore.ieee.org/stamp/stamp.jsp?arnumber=6198376\"><span style=\"font-family:Calibri;font-size:10.0pt;\">pdf</span></a></li><li style=\"margin-bottom:8pt;margin-top:0pt;vertical-align:middle;\"><p><span style=\"font-family:Calibri;font-size:10.0pt;\"><strong>Nitta, N.; Wu, F.; Lee, J. T.; Yushin, G.&nbsp;</strong></span></p><p><strong>“</strong>Li-ion battery materials: Present and future,”</p><p><i>Materials Today</i>, 18 (2015) 252–264. <a href=\"https://ltschem-my.sharepoint.com/:b:/p/sgeddam/IQAVkSha2F-GQodYQ_9UvW25AWshMblZm86me8yrhzi3-WM?e=pLpK3h\">pdf</a></p></li></ol>","isAiData":true,"isHazmatAsPowder":false,"hazmatAsPowder":"","tags":[{"id":26,"name":"Battery Materials","link":"battery_materials","type":"chemical"},{"id":58,"name":"Semiconductor","link":"semiconductor_chemical","type":"chemical"},{"id":82,"name":"TFT Display","link":"tft_display_chemical","type":"chemical"},{"id":275,"name":"Backing plate","link":"backing plate_chemical","type":"chemical"},{"id":308,"name":"3D Printing","link":"3d_printing_chemical","type":"chemical"},{"id":420,"name":"Evaporation Deposition Materials ","link":"evaporationdepositionmaterials_chemicals","type":"chemical"}]},"userChangedBy":null,"ProductPrice":[{"id":125824,"productId":9175,"price":120,"quantity":1,"um":"pcs","locked":false,"isShow":true,"createdAt":"2020-08-19T15:26:42.000Z","updatedAt":"2020-08-19T15:26:42.000Z","bulkAvailable":null,"bulkAvailability":false,"packaging":null,"customerId":null,"type":"default","version":1,"quoteId":null},{"id":125825,"productId":9175,"price":218.4,"quantity":2,"um":"pcs","locked":false,"isShow":true,"createdAt":"2020-08-19T15:26:42.000Z","updatedAt":"2020-08-19T15:26:42.000Z","bulkAvailable":null,"bulkAvailability":false,"packaging":null,"customerId":null,"type":"default","version":1,"quoteId":null},{"id":125826,"productId":9175,"price":522,"quantity":5,"um":"pcs","locked":false,"isShow":false,"createdAt":"2020-08-19T15:26:42.000Z","updatedAt":"2020-08-19T15:26:42.000Z","bulkAvailable":null,"bulkAvailability":false,"packaging":null,"customerId":null,"type":"default","version":1,"quoteId":null}],"Vendor":[],"tags":[],"favorites":[]}